Wire Sawing
Wire sawing is a method for slicing and cutting silicon wafers, granite, marble, and stone. In wire sawing, a taut steel wire is run through an abrasive slurry of silicon carbide, which acts as the cutting agent between the workpiece and the wire. Wire sawing is commonly used in the granite and stone cutting industry, silicon wafer production, and other crystal cutting applications. The wire sawing method is particularly effective for semiconductor materials because it cuts crystals with a high yield and small kerf loss.
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Hand Sawing
Hand sawing refers to the lighter duty use of diamond blades in handheld power saws and chain type saws. Hand sawing provides portability, speed, and accessibility at construction and demolition sites. Typical applications include sawing concrete pipe to length; creating openings for electrical, plumbing, or other needs in concrete walls, floors, and ceilings; eliminating overcuts associated with other types of sawing; and precision trimming.
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